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In today’s test environment, site counts, pin counts and resource demands of testers are ever increasing, yet few investments are being made to increase overall applications space and loadboard size.  …

Pitch Translation - Current Situation: A common problem in the Semiconductor test interface world is the continuously shrinking package sizes and pitches required in designing and building test interface…

DISRUPTIVE Technology or SUSTAINING and FRUGAL innovation? Reducing complexity through advanced pitch translation design: NextWave 360 has developed a revolutionary pitch translation device (P2 Interposer)…

Semiconductor Wafer Test Workshop is next week (June 4-6).  Please come by our booth (B2) in the Bernardo Foyer to learn more about our innovative solutions to lowering the complexity of PCB design for…

Devices are getting smaller, and so are their pins.  Loadboards, however, are not.  PCB technology has been slow to adapt to rapidly shrinking packages and form factors.  Conventional tricks of the trade…